NXT III

The proliferation of multifunction and high-performance electronics has been growing rapidly in areas such as mobile devices and car electronics. However, because these products tend to have short life cycles, production equipment that has the flexibility to respond to ramping up to mass production in a short amount of time and changes in demand is sought after.

The NXT III is a modular SMT mounter that is able to provide the best line every time for factories that have such kinds of frequent changes for producing electronics devices.

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Features

Heads can be exchanged easily

Heads can be exchanged easily without tools.

The heads are lightweight and thus can be removed easily by a machine operator when needing to perform maintenance or troubleshooting when responding to issues.

High speed and high accuracy

Having compact and lightweight heads reduced the load on the machine. As a result, the modules themselves are able to be compact while maintaining high speed and high accuracy.

NXT III special lineup

17% increase in performance

The speed of operations frequently used in actual production has been increased intensively, improving the throughput by 17% compared to previous models.

The M3 IIISE module is effective for module part boards, smartphone boards, and other such panels which have high-density part population

NXT Spare parts

Realtime load control

As parts continue to become even smaller, thinner, and lighter the demand for low-impact placement, in addition to placement accuracy, is also increasing. The combination of the H12L head with the M6 IIIL module makes it possible to control the load during placement in real time. This means that parts can always be placed using the same load regardless of the condition of the panel, preventing damage to parts.

NXT Head for sale

By loading dedicated heads and units into the machine, specific processes such as glue application and flux transfer can be performed inline. This contributes to the reduction of incomplete products and removes the need for investing in dedicated equipment.

NXT Spare parts

SPECIFICATIONS

M3 III

M6 III

Applicable PCB size (LxW)

48 x 48 mm to 250 x 510 mm (double conveyor)*
48 x 48 mm to 250 x 610 mm (single conveyor)
*Double conveyors can handle PCBs up to 280 (W) mm. PCBs larger than 280 (W) mm must be produced by changing the double conveyor to single lane production mode.

48 x 48 mm to 534 x 510 mm (double conveyor)*
48 x 48 mm to 534 x 610 mm (single conveyor)
*Double conveyors can handle PCBs up to 280 (W) mm. PCBs larger than 280 (W) mm must be produced by changing the double conveyor to single lane production mode.

Part types

Up to 20 types of parts (calculated using 8 mm tape)

Up to 45 types of parts (calculated using 8 mm tape)

PCB loading time

For double conveyor: 0 sec (continuous operation)
For single conveyor: 2.5 sec (transport between M3 III modules), 3.4 sec (transport between M6 III modules)

Placement accuracy
(Fiducial mark standard)
* The placing accuracy is obtained from tests conducted by Fuji.

H24G

: +/-0.025 mm (Standard mode) / +/-0.038 mm (Productivity priority mode) (3sigma) cpk≥1.00

V12/H12HS

: +/-0.038 (+/-0.050) mm (3sigma) cpk≥1.00

H04S/H04SF

: +/-0.040 mm (3sigma) cpk≥1.00

H08/H04

: +/-0.050 mm (3sigma) cpk≥1.00

H02/H01/G04

: +/-0.030 mm (3sigma) cpk≥1.00

H02F/G04F

: +/-0.025 mm (3sigma) cpk≥1.00

: +/-0.100 mm (3sigma) cpk≥1.00

H24G

: +/-0.025 mm (Standard mode) / +/-0.038 mm (Productivity priority mode) (3sigma) cpk≥1.00

V12/H12HS

: +/-0.038 (+/-0.050) mm (3sigma) cpk≥1.00

H08M/H04S/H04SF

: +/-0.040 mm (3sigma) cpk≥1.00

H08/H04/OF

: +/-0.050 mm (3sigma) cpk≥1.00

H02/H01/G04

: +/-0.030 mm (3sigma) cpk≥1.00

H02F/G04F

: +/-0.025 mm (3sigma) cpk≥1.00

: +/-0.100 mm (3sigma) cpk≥1.00

Productivity
* The throughput above is based on tests conducted at Fuji.

H24G

: 37,500 cph (Productivity priority mode) / 35,000 cph (Standard mode)

V12

: 26,000 cph

H12HS

: 24,500 cph

H08

: 11,500 cph

H04

: 6,500 cph

H04S

: 9,500 cph

H04SF

: 10,500 cph

H02

: 5,500 cph

H02F

: 6,700 cph

H01

: 4,200 cph

G04

: 7,500 cph

G04F

: 7,500 cph

: 16,363 dph (0.22 sec/dot)

H24G

: 37,500 cph (Productivity priority mode) / 35,000 cph (Standard mode)

V12

: 26,000 cph

H12HS

: 24,500 cph

H08M

: 13,000 cph

H08

: 11,500 cph

H04

: 6,500 cph

H04S

: 9,500 cph

H04SF

: 10,500 cph

H02

: 5,500 cph

H02F

: 6,700 cph

H01

: 4,200 cph

G04

: 7,500 cph

G04F

: 7,500 cph

: 3,000 cph

: 16,363 dph (0.22 sec/dot)

Supported parts

H24G

: 0201 to 5 x 5 mm

Height

: up to 2.0 mm

V12/H12HS

: 0402 to 7.5 x 7.5 mm

Height

: up to 3.0 mm

H08M

: 0603 to 45 x 45 mm

Height

: up to 13.0 mm

H08

: 0402 to 12 x 12 mm

Height

: up to 6.5 mm

H04

: 1608 to 38 x 38 mm

Height

: up to 9.5 mm

H04S/H04SF

: 1608 to 38 x 38 mm

Height

: up to 6.5 mm

H02/H02F/H01/0F

: 1608 to 74 x 74 mm (32 x 180 mm)

Height

: up to 25.4 mm

G04/G04F

:0402 to 15 x 15 mm

Height

: up to 6.5 mm

Module width

320 mm

645 mm

Machine dimensions

L: 1295 mm (M3 III x 4, M6 III x 2) / 645 mm (M3 III x 2, M6 III)
W: 1900.2 mm, H: 1476 mm

DynaHead(DX)
Nozzle quantity	12	4	1
Throughput(cph)	25,000 Parts presence function ON: 24,000	11,000	4,700
Part size (mm)	0402 (01005") to 7.5 x 7.5 Height: Up to 3.0 mm	1608 (0603") to 15 x 15 Height: Up to 6.5 mm	1608 (0603") to 74 x 74 (32 x 100) Height: Up to 25.4 mm
Placing accuracy (Fiducial mark based referencing)	+/-0.038 (+/-0.050) mm (3σ) cpk≥1.00* *+/-0.038 mm obtained with rectangular chip placement (high accuracy tuning) under optimal conditions at Fuji.	+/-0.040 mm (3σ) cpk≥1.00	+/-0.030 mm (3σ) cpk≥1.00
Part presence check	o	x	o
Parts supply	Tape	o	o	o
Stick	x	o	o
Tray	x	o	o

DynaHead(DX)

Nozzle quantity

Throughput(cph)

25,000
Parts presence function ON: 24,000

11,000

4,700

Part size
(mm)

0402 (01005") to 7.5 x 7.5
Height:
Up to 3.0 mm

1608 (0603")
to 15 x 15
Height:
Up to 6.5 mm

1608 (0603")
to 74 x 74 (32 x 100)
Height:
Up to 25.4 mm

Placing accuracy
(Fiducial mark based referencing)

+/-0.038 (+/-0.050) mm (3σ) cpk≥1.00*
*+/-0.038 mm obtained with rectangular chip placement (high
accuracy tuning) under optimal conditions at Fuji.

+/-0.040 mm (3σ) cpk≥1.00

+/-0.030 mm (3σ) cpk≥1.00

Part presence
check

Parts
supply

Tape

Stick

Tray

Parts supply system
lntelligent feeders	Support for 4, 8, 12, 16, 24, 32, 44, 56, 72, 88, and 104 mm wide tape
Stick feeders	4 ≤ Part width ≤ 15 mm (6 ≤ Stick width ≤ 18 mm), 15 ≤ Part width ≤ 32 mm (18 ≤ Stick width ≤ 36 mm)
Trays	Applicable tray size: 135.9 x 322.6 mm (JEDEC standard) (Tray Unit-M) ， 276 x 330 mm (Tray Unit- LT), 143 x 330 mm (Tray Unit-LTC)

Parts supply system

lntelligent feeders

Support for 4, 8, 12, 16, 24, 32, 44, 56, 72, 88, and 104 mm wide tape

Stick feeders

4 ≤ Part width ≤ 15 mm (6 ≤ Stick width ≤ 18 mm), 15 ≤ Part width ≤ 32 mm (18 ≤ Stick width ≤ 36 mm)

Trays

Applicable tray size: 135.9 x 322.6 mm (JEDEC standard) (Tray Unit-M) ， 276 x 330 mm (Tray Unit- LT), 143 x 330 mm (Tray Unit-LTC)

Options
Tray feeders, PCU II (Pallet Change Unit), MCU (Module change unit), Engineering panel stand, FUJI CAMX Adapter, Nexim Software

Options

Tray feeders, PCU II (Pallet Change Unit), MCU (Module change unit), Engineering panel stand, FUJI CAMX Adapter, Nexim Software

CHIP MOUNTER

SCREEN PRINTER

REFLOW OVEN

SPI

AOI

Panasonic

YAMAHA

FUJI

JUKI

KE-3010

NXT III

Features

Heads can be exchanged easily

Heads can be exchanged easily without tools.

The heads are lightweight and thus can be removed easily by a machine operator when needing to perform maintenance or troubleshooting when responding to issues.

High speed and high accuracy

Having compact and lightweight heads reduced the load on the machine. As a result, the modules themselves are able to be compact while maintaining high speed and high accuracy.

NXT III special lineup