Test Research, Inc. (TRI), a global leading provider of electronics manufacturing test and inspection solutions, has launched the new TR7950Q SII Series. This modular platform is specially designed for semiconductor back-end processes and advanced packaging inspection from patterning to wafer saw, setting new industry benchmarks for wafer inspection and micro-measurement metrology.
The AI-powered TR7950Q SII features a high-stability granite platform and supports 6-inch to 12-inch wafers for wide compatibility with mainstream semiconductor production lines. Equipped with robust Automated Visual Inspection (AVI) technology, the system delivers high-speed detection of common wafer surface defects including particles, scratches, chipping, contamination and foreign materials to boost production yield.
An optional Short-Wave Infrared (SWIR) module enables silicon penetration to detect hidden subsurface cracks and invisible internal defects missed by standard sensors. For ultra-precise inspection needs, the configurable 3D DFF module provides selectable 0.5 µm or 1 µm high-resolution imaging to meet strict Chiplet and high-end packaging quality standards.
Beyond defect detection, the platform offers comprehensive high-precision metrology. It accurately measures wafer thickness, top-side warpage and complex surface topography, while supporting high-speed metrology for critical advanced packaging metrics: TSV depth, trench dimensions, thin film and Chiplet parameters.
About Test Research, Inc. (TRI)
TRI is a global specialist in intelligent, automated test and inspection solutions for semiconductor and electronics manufacturing. The company delivers high-precision industrial equipment to help manufacturers enhance production efficiency, optimize product quality and cut operational costs across semiconductor packaging, PCB and electronic assembly processes.